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Metal Bond Hub Less Dicing Blades

Product Details

Customization:	Available
Manufacturing Process:	Sintered
Shape:	Dish-Shaped

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Luoyang Bearing Research Institute Co., Ltd.

Manufacturer/Factory

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Diamond Member Since 2014

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Audited by an independent third-party inspection agency

Number of Employees

708

Management System Certification

ISO9001:2008, Weapon Equipment Quality Management System Certificate

Metal Bond Hub Less Dicing Blades pictures & photos

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Product Description

Company Info.

Basic Info.

Model NO.

1A8 M

Transport Package

Carton

Specification

1A8 58; 56 and etc

Trademark

ZZSM

Origin

China

HS Code

680421

Production Capacity

500000PC/ Month

Product Description

Metal Bond Hub less Dicing Blades can be used for dicing glass, ceramic material and specially used for dicing BGA,LGA,MEMS,CSP,LED,SD Card,Diodes, as well as semiconductor crystal materials and various composite structure electronic devices. They are super-thin and can reach the thickness of 0.04mm and with high precision level and suitable for small grooves and and also for cut off!

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Luoyang Bearing Research Institute Co., Ltd.

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