Metal Bond Hub Less Dicing Blades

Product Details
Customization: Available
Manufacturing Process: Sintered
Shape: Dish-Shaped
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Number of Employees
708
Management System Certification
ISO9001:2008, Weapon Equipment Quality Management System Certificate
  • Metal Bond Hub Less Dicing Blades
  • Metal Bond Hub Less Dicing Blades
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Basic Info.

Model NO.
1A8 M
Bonding Agent
Metal
Transport Package
Carton
Specification
1A8 58; 56 and etc
Trademark
ZZSM
Origin
China
HS Code
680421
Production Capacity
500000PC/ Month

Product Description

Metal Bond Hub less Dicing Blades can be used for dicing glass, ceramic material and specially used for dicing BGA,LGA,MEMS,CSP,LED,SD Card,Diodes, as well as semiconductor crystal materials and various composite structure electronic devices. They are super-thin and can reach the thickness of 0.04mm and with high precision level and suitable for small grooves and and also for cut off!

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