Metal Bond Hub Less Dicing Blades

• Manufacturing Process: Sintered
• Shape: Dish-Shaped
• Bonding Agent: Metal
• Transport Package: Carton
• Specification: 1A8 58; 56 and etc
• Trademark: ZZSM
• Model NO.: 1A8 M
• Origin: China
• HS Code: 680421
• Production Capacity: 500000PC/ Month

Product Description

Metal Bond Hub less Dicing Blades can be used for dicing glass, ceramic material and specially used for dicing BGA,LGA,MEMS,CSP,LED,SD Card,Diodes, as well as semiconductor crystal materials and various composite structure electronic devices. They are super-thin and can reach the thickness of 0.04mm and with high precision level and suitable for small grooves and and also for cut off!