• Resin Bond Hub Less Dicing Blades
  • Resin Bond Hub Less Dicing Blades

Resin Bond Hub Less Dicing Blades

Manufacturing Process: Sintered
Shape: Dish-Shaped
Bonding Agent: Resin
Transport Package: Carton
Specification: 1A8 58; 56 and etc
Trademark: ZZSM
Samples:
US$ 1/Piece 1 Piece(Min.Order)
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Customization:
Diamond Member Since 2014

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Basic Info.

Model NO.
1A8
Origin
China
HS Code
680421
Production Capacity
500000PC/ Month

Product Description

Resin Bond Hub less Dicing Blades can be used for dicing glass, ceramic material and specially used for dicing BGA,QFN,DFN,PQFN,CSP and etc. They are super-thin and can reach the thickness of 0.048mm and with high precision level and suitable for small grooves and and also for cut off!

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