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Resin Bond Diamond Grinding Wheels for Tungsten Carbide, Ceramic Materials, Magnetic Materials, Silicon Materials, Thermal Spraying Alloy Materials

Manufacturing Process:	Cold Pressing and Hot Pressing
Shape:	Flat-Shaped
Bonding Agent:	Resin
Diameter Range:	6~1100mm
Thickness Range:	0.07~520mm
Drit Size Range:	40/50~W3.5

Customization:	Available \| Customized Request

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